Embedded system module thermal installation verification

ABSTRACT

Systems and methods for detecting an incorrectly attached heat sink component on an electronic device. The system includes one or more temperature sensors secured to the electronic device and a controller unit comprising one or more processors and one or more computer-readable media, the computer-readable media having stored thereon executable instructions that are executable by the one or more processors to perform a method for detecting incorrectly attached heat sink components. The method includes receiving temperature data, calculating a thermal ramp rate, comparing the thermal ramp rate to a predetermined threshold ramp rate, and transmitting a fault signal when the calculated thermal ramp rate exceeds the predetermined threshold ramp rate.

BACKGROUND

According to at least one study, high temperatures account for over halfof electronic equipment failures. At excessive temperatures, electronicdevices have reduced reliability, increased likelihood of permanentfailure, and a high risk of undergoing undetected damage. Accordingly,methods are needed to thermally protect electronic devices and to aid inthe diagnosis of temperature related failures.

Sophisticated electronic modules are often encased in carriers which arein turn mounted within a multi-module shelf configured for conductioncooling of the overall system of individual modules. Such modules aregenerally secured within the shelf where a lock mechanism ensures notonly optimal secure attachment between the electronic module and theshelf but can also provide heat transfer from the individual module tothe shelf. Without a proper connection between the lock mechanism andthe shelf unit, the likelihood of overheating of the electronic moduleincreases significantly. Providing a proper connection can, therefore,aid with maintaining longevity of the electronic module.

The subject matter claimed herein is not limited to embodiments thatsolve any disadvantages or that operate only in environments such asthose described above. Rather, this background is only provided toillustrate one exemplary technology area where some embodimentsdescribed herein may be practiced.

BRIEF SUMMARY

One embodiment illustrated herein includes a method that may bepracticed for detecting an incorrectly attached heat sink, such as isassociated with a lock mechanism having heat sink components. The methodincludes identifying a thermal ramp rate of the electronic device whilethe electronic device is in operation, determining that the identifiedthermal ramp rate exceeds a predetermined threshold ramp rate, andtransmitting a fault signal to a user interface when the identifiedthermal ramp rate exceeds the predetermined threshold ramp rate. In someembodiments, the predetermined threshold ramp rate is selected from aplurality of threshold ramp rates based upon an ambient or componenttemperature and a power consumption of the electronic device.

Another embodiment includes a system for detecting an incorrectlyattached heat sink, such as is associated with a lock mechanismincorporating heat sink functionality. The system includes one or moretemperature sensors secured to the electronic device, a controller unithaving one or more processors and one or more computer-readable media.The computer-readable media of the controller has stored thereoninstructions that are executable by the one or more processors toperform of the methods illustrated herein. The system may includeadditional hardware for use by or in conjunction with the electronicdevice for carrying out the aforementioned method, such as but notlimited to a programmable memory unit, a serial communication bus,and/or a user interface component.

An additional embodiment includes a computer-readable media comprisingone or more physical computer-readable storage media having storedthereon computer-executable instructions that, when executed at aprocessor, cause a computer system to perform the method(s) fordetecting an incorrectly attached heat sink component as describedherein.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

Additional features and advantages will be set forth in the descriptionwhich follows, and in part will be obvious from the description, or maybe learned by the practice of the teachings herein. Features andadvantages of the invention may be realized and obtained by means of theinstruments and combinations particularly pointed out in the appendedclaims. Features of the present invention will become more fullyapparent from the following description and appended claims, or may belearned by the practice of the invention as set forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to describe the manner in which the above-recited and otheradvantages and features can be obtained, a more particular descriptionof the subject matter briefly described above will be rendered byreference to specific embodiments which are illustrated in the appendeddrawings. Understanding that these drawings depict only typicalembodiments and are not therefore to be considered to be limiting inscope, embodiments will be described and explained with additionalspecificity and detail through the use of the accompanying drawings inwhich:

FIG. 1A illustrates an exemplary electronic device having multiple heatsink components in position for mounting within a rack;

FIG. 1B illustrates the functionality of the heat sink components of theexemplary electronic device of FIG. 1A with the electronic devicemounted within a rack;

FIG. 2 illustrates an overview of a system for detecting incorrectlyattached heat sink components;

FIG. 3 illustrates a graphical representation of a method for detectionof an incorrectly attached heat sink component;

FIG. 4 illustrates a flowchart of a method for detecting an incorrectlyattached heat sink component on an electronic device;

FIG. 5 illustrates an exemplary table of predetermined threshold ramprates corresponding to an incorrectly attached heat sink component;

FIG. 6 illustrates a graph showing exemplary ramp rates corresponding toa varying number of both correctly and incorrectly attached heat sinkcomponents; and

FIG. 7 illustrates a flowchart of a method for detecting an incorrectlyattached heat sink component on an electronic device having at least twoseparate heat sink components.

DETAILED DESCRIPTION

Embodiments illustrated herein are directed to apparatuses, systems andmethods for detecting an incorrectly attached heat sink component on anelectronic device. While some embodiments described herein are directedto using customized and/or existing hardware to detect one or moreincorrectly attached locking mechanisms, such as wedge locks, on anembedded system module, the systems described herein may be embodied inother specific forms to detect the improper connection of a variety ofheat sink components on a variety of electronic devices.

The following discussion also refers to a method that may be performed.Although the method may be discussed in a certain order or illustratedin a flow chart as occurring in a particular order, no particularordering is required unless specifically stated, or required because oneportion of method is dependent on another portion of the method beingcompleted prior to the one portion of the portion is performed.

Referring now to FIGS. 1A-1B, an exemplary electronic device 100 isillustrated. In the illustrated example, electronic device 100 comprisesa circuit card carrier 102 and two lock mechanisms 104 a, 104 b forsecuring electronic device 100 within a circuit card rack 106 and forproviding a thermal cooling path for heat removal from electronic device100. The lock mechanisms 104 a, 104, therefore, act as heat sinks todissipate heat from the electronic device 100 to the circuit card rack106. When lock mechanisms 104 a, 104 b are properly connected or engagedwithin respective mounting slots 108 a, 108 b of circuit card rack 106,a thermal cooling path 110 is established between electronic device 100and circuit card rack 106, ensuring optimum heat dissipation duringoperation of electronic device 100.

One skilled in the art will appreciate that, in view of the presentdisclosure, electronic device 100 can include any device having heatsink components that perform optimally when properly connected ortightened to the electronic device. As a non-limiting example,electronic device 100 can be a communication module built to VITA/VPXindustry standards and typically including a pair of wedge lockmechanisms for securing the device and providing a heat transfer pathbetween the module and the chassis to which the module is secured. Otherexamples of electronic devices include, but are not limited to compactperipheral component interconnect (PCI) modules and any other types ofconduction cooled modules incorporating wedge lock mechanisms, or anysystem wherein the primary thermal conduction path may becomecompromised or disconnected.

As illustrated, circuit card carrier 102 of electronic device 100 isconfigured to be inserted into mounting slots 108 a, 108 b of circuitcard rack 106 with lock mechanisms 104 a, 104 b initially disengaged;the mounting slots 108 a, 108 b being formed between adjacent mountingsupports 116 a, 116 b. Circuit card carrier 102 may then be secured tocircuit card rack 106 by engaging lock mechanisms 104 a, 104 b usingrespective drive screws 112 a, 112 b. For instance, where the lockmechanisms 104 a, 104 b are wedge locks, rotation of the drive screws112 a, 112 b causes wedges 114 to move outwardly to press against aninside surface 118 of the respective mounting slot 108 a, 108 b, i.e.,against the mounting supports 116 a, 116 b. While reference herein ismade to wedge locks as the lock mechanisms, 104 a, 104 b one skilled inthe art will appreciate that the present invention can be used withother lock mechanisms that lock a circuit card carrier within mountingslots of a circuit card rack and provide a thermal cooling path for heatremoval. Those lock mechanisms can include, but are not limited to, anytype of module Circuit Card Assembly (CCA) locking mechanism that isused to establish a thermal path for conduction cooling.

In the event that an operator or technician neglects to properly engagelock mechanisms 104 a, 104 b, thermal cooling path 110 between circuitcard carrier 102 and circuit card rack 106 is left at least partiallyunformed, which is likely to result in overheating of the electronicdevice during operation. Accordingly, methods, apparatuses, and systemsof the present disclosure enable prevention of thermal damage or failureof electronic devices due to incorrectly attached heat sink components,such as lock mechanisms 104 a, 104 b, which results in insufficiency ofthe heat sink components to create the cooling thermal path for heatremoval.

One skilled in the art will appreciate that the disclosed methods,systems and apparatuses are not to be limited to detection ofincorrectly attached lock mechanisms, such as wedge locks, asillustrated. For instance, embodiments can readily be implemented todetect improper connection of virtually any type or style of heat sinkcomponent or to detect a variety of related thermal issues duringoperation of an electronic device.

Turning to FIG. 2 , schematically illustrated is a system 200 fordetecting an incorrectly attached heat sink component on an electronicdevice, such as, for example, the electronic device 100 having lockmechanisms 104 a, 104 b. The system 200 is configured to provide awarning to the user or technician mounting the electronic device 100 tothe circuit card rack 106.

As illustrated, embodiments of system 200 for detecting an incorrectlyattached heat sink component on an electronic device can includehardware and software integrated with one or more existing circuit cardassemblies 202 of the electronic device 100 to monitor one or morethermal ramp rates of the electronic device 100. Alternatively, thehardware, firmware, and software necessary to implement methods of thepresent disclosure can be implemented separate from the electronicdevice, such as by introduction of an additional device or computersystem configured to monitor and evaluate the thermal ramp rates of theseparate electronic device.

As shown, system 200 includes various components in communication withcircuit card assembly 202 via a serial bus 204. For example, serial bus204 may include an inter-integrated circuit (12C) serial communicationbus. System hardware, and associated software, in communication withserial bus 204 include storage 206 for storing predetermined thresholdramp rates 212, controller 208 for processing data and transmittingfault signals and/or reset commands, and sensors 210 for measuring thepresent temperature of the electronic device in one or more locations.Although system 200 as shown specifically includes left and righttemperature sensors 214 a and 214 b corresponding to left and right heatsink components (such as lock mechanisms 104 a, 104 b of FIGS. 1A-1B),additional or fewer sensors can be included as required. For example, ifthe electronic device does not have existing sensors for ambient orcomponent temperature and/or power consumption, system 200 can bemodified to include such sensors.

A controller 208, such as a micro controller unit or other controller,further includes a central processing unit (CPU) 216, dedicated memory218, and input/output (I/O) hardware 220 for transmitting and receivingdata and commands. As shown, controller 208 communicates directly with auser interface 222 to notify the user or operator of any faultsdetected. According to the methods disclosed herein, controller 208receives electronic device parameters from circuit card assembly 202 andfrom sensors 210 through serial bus 204 to monitor the thermal responseof the electronic device, such as electronic device 100.

As shown, controller 208 is configured to receive temperature data fromleft temperature sensor 214 a associated with a heat sink component on aleft side of the electronic device (such as lock mechanism 104 a), andright temperature sensor 214 b associated with a heat sink component onthe right side of the electronic device (such as lock mechanism 104 b).System 200 is thus configured to monitor the thermal response associatedwith two separate heat sink components. For instance, controller 208 isconfigured to continuously calculate thermal ramp rates from temperaturereadings provided by left and right temperature sensors 214 a and 214 band compare them to threshold ramp rates 212 accessed from storage 206.If, at any time during operation of system 200, the calculated thermalramp rate exceeds the corresponding threshold ramp rate, controller 208transmits a fault signal to user interface 222.

Specifically, if the thermal ramp rate calculated from data receivedfrom left temperature sensor 214 a exceeds the threshold thermal ramprate corresponding to the electronic device's present ambient orcomponent temperature and power consumption, then controller 208activates an LED or other indicator 224 a to notify the operator that aheat sink component on the left side of the device is incorrectlyattached. Likewise, if the thermal ramp rate calculated from datareceived from right temperature sensor 214 b exceeds the thresholdthermal ramp rate corresponding to the electronic device's presentambient or component temperature and power consumption, then controller208 activates an LED or other indicator 224 b to notify the operatorthat a heat sink component on the right side of the device isincorrectly attached. Also, a general fault LED 226 is included toenable indication of additional faults or errors, such as a thresholdtemperature is reached. Alternatively, user interface 222 can includeany means for notifying the operator, such as a computer monitor, an LCDdisplay, a speaker, and so forth.

Additionally, hardware system 200 can be configured to communicatethrough a network 228 with an external device 230, to allow formonitoring and adjustments to system 200 and its various components, orimplementation and adjustment of software-based methods according to thepresent disclosure. Alternatively, external device 230 can be in directcommunication with hardware system 200 via a wired or wirelessconnection.

Referring now to FIG. 3 , a graphical representation of the temperatureof the electronic device, such as electronic device 100 of FIGS. 1A-1B,in relation to time in operation. In particular, FIG. 3 illustrates atypical thermal response of the electronic device, such as electronicdevice 100 of FIGS. 1A-1B, under two controlled scenarios: (1) firsttemperature curve 302 corresponds to an electronic device having aneffective thermal cooling path provided by properly connected heat sinkcomponent such as when the lock mechanisms 104 a, 104 b mate with theslots 108 a, 108 b; and (2) second temperature curve 304 corresponds tothe same electronic device having an ineffective or nonexistent thermalcooling path due to an incorrectly attached heat sink component, such aswhen at least one of the lock mechanisms 104 a, 104 b ineffectivelymates or engages with the mounting supports 116 a, 116 b.

Existing methods for preventing thermal damage and device failure due tooverheating include monitoring the temperature of the electronic deviceand issuing a warning or shutting down the electronic device when apredetermined threshold temperature is reached. Use of an absolutethermal limit based on the temperature of the electronic device canoften lead to damage to the electronic device as the warning and/orshutdown of the device is only implemented after an excessivetemperature is reached or after the temperature is rising too quickly toprevent overheating. Further, selecting an absolute thermal limitcorresponding to a conservatively low temperature in order to preventthermal damage can substantially limit the utility of the electronicdevice.

In contrast, methods, apparatuses, and systems of the present disclosurerely on thermal ramp rate to determine whether a heat sink component,such as a wedge lock as the lock mechanism, is connected properly toproduce an effective thermal cooling path. By determining a thresholdthermal ramp rate upon which a fault warning and/or shutdown command isissued, embodiments of the present disclosure enable detection ofincorrectly attached heat sink components earlier than the existingmethods that rely on a threshold temperature of the electronic device.Absolute thermal limits can still be set to account for the variousfactors that may lead to overheating of the electronic device but,according to embodiments of the present disclosure, detection ofincorrectly attached heat sink devices can be achieved well before anexcessive temperature is reached.

As illustrated in FIG. 3 , the thermal ramp rate 308 (i.e., the slope ordifferential with respect to time) of the second temperature curve 304exceeds the thermal ramp rate 306 of the first temperature curve 302. Inother words, the thermal ramp rate 308 experienced by the electronicdevice, such as electronic device 100, having an incorrectly attachedheat sink component, such as lock mechanisms 104 a, 104 b, exceeds thethermal ramp rate 306 of the electronic device 100 having properlysecured heat sink components or lock mechanisms 104 a, 104 b. Byselecting a threshold thermal ramp rate based on thermal ramp rate 308that electronic device 100 exhibits under controlled circumstances,methods of the present disclosure enable detection of incorrectlyattached heat sink components or lock mechanisms 104 a, 104 b before theelectronic device 100 reaches an excessive temperature.

According to embodiments of the present disclosure, the thermal ramprate 308 is identified as a threshold ramp rate for the particulartemperature and power consumption level (i.e., current) at which thethermal ramp rates 306, 308 of FIG. 3 were observed. For example, theelectronic device 100 is turned on at 310 and allowed to power up until312 is reached, upon which monitoring of the thermal ramp rate of theelectronic device 100 is initiated by, for example, a monitoring systemsuch as system 200 of FIG. 2 . While monitoring the thermal ramp rate,if the rate exceeds predetermined thermal ramp rate 308 (accessible bycontroller 208 from storage 206), a fault signal is transmitted bycontroller 208 to a user interface 22 to notify the operator and, ifappropriate, a reset command is issued to shut down the electronicdevice 100 or an existing circuit card assembly device 202 thereof.

Referring now to FIG. 4 , a flowchart of a method 400 for detecting anincorrectly attached heat sink component on the electronic device 100 isillustrated. Method 400 begins at 402 with receiving electronic deviceparameters either directly from the electronic device 100 or via sensorsdirectly associated with the electronic device 100 (such as sensors210). Device parameters are preferably received in real-time forcontinuous monitoring, and may include ambient temperature (i.e., theenvironmental temperature in which the electronic device is presentlyoperating) or the temperature of the electronic device or a componentthereof, power consumption (i.e., electrical current), and thetemperature of the electronic device at one or more locations (e.g.,left and right temperature sensors 214 a, 214 b).

Next, at 404, the method includes identifying a thermal ramp rate of theelectronic device 100 by periodically calculating the slope of thetemperature response of the thermal device at the aforementioned one ormore locations. After a thermal ramp rate of the electronic device 100has been identified, the method includes, at 406, comparing theidentified thermal ramp rate to a predetermined threshold ramp rate 212,such as described in relation to FIG. 3 herein. In some embodiments, aplurality of predetermined threshold ramp rates 212 is utilized, eachbased on the present ambient or component temperature and/or powerconsumption of the electronic device, as shown in FIG. 5 , for example.Embodiments may also include a single threshold ramp rate 212 that doesnot depend on present device parameters if appropriate under thecircumstances. For example, if an electronic device 100 is intended foruse in environments with generally consistent ambient temperatures andat a generally consistent level of power consumption, a plurality ofpredetermined threshold ramp rates may not be necessary.

If it is determined that the calculated thermal ramp rate does notexceed the predetermined ramp rate 212, such as the decision at 408being negative, the method is returned to receiving electronic deviceparameters at 402 and each the method is repeated in order tocontinuously monitor the thermal ramp rate of the electronic device 100.During such continuous monitoring, however, if it is determined that thecalculated thermal ramp exceeds the predetermined ramp rate 212 at 408,such that decision is in the affirmative, the method proceeds totransmit a fault signal to a user interface 222 to notify the operatorof an incorrectly attached heat sink component or related issue, such asa 410.

Following fault signal transmission at 410, so long as the electronicdevice 100 remains in operation, method continues to monitor the ramprate by receiving the electronic device parameters at 402, anddetermining with each repetition of method 400 whether to continuetransmission of the fault signal at 410. Additionally, or alternatively,reset or shutdown commands can be transmitted to the electronic device100, depending on the requirements set by the operator at 412. Forinstance, if the electronic device 100 is critical to the operation ofthe overall system or vital to the safety of the operator, it may bedetermined that the electronic device 100 should be permitted tocontinue operation despite any indication of incorrectly attached heatsink components. By contrast, in order to prevent damage to theelectronic device 100, a non-critical electronic device 100 may beconfigured to automatically reset or shut down when it is determinedthat a heat sink component is incorrectly attached.

Referring now to FIG. 5 , an exemplary table of predetermined thresholdramp rates 212 is presented. The table of FIG. 5 is illustrative and notindicative of absolute values of threshold ramp rates, with it beingunderstood by one skilled in the art that various threshold ramp ratesare possible. For instance, and not by way of limitation, threshold ramprates may be impacted by one or more of the following: module thermalcapacitance, wedge lock thermal resistance, module power dissipation andpower distribution, the total power distribution of the next higherassembly, combinations and/or modifications thereof. It will beunderstood by one skilled in the art that the preceding is anon-exhaustive list of variables that could impact the ramp rates andthat one skilled in the art can identify other variables that can impactthe ramp rates based upon, at least in part, this disclosure orotherwise contemplated by this disclosure.

One or more tables such as that shown in FIG. 5 may thus be stored in astorage device 206 of a hardware system 200 according to embodiments ofthe present disclosure, such that controller 208 may be configured toselect a predetermined ramp rate 212 from the table(s) based onparameters received from sensors 210 or directly from electronic device100. As shown, each predetermined threshold ramp rate 212 corresponds toa particular ambient or component temperature and power consumption ofthe electronic device 100. Such a table of predetermined threshold ramprates 212 may be determined on an individual basis for each electronicdevice 100, or parameters can be determined for basic modifications to abaseline electronic device to simplify the process. By determiningthreshold ramp rates 212 under various operation conditions, methods ofthe present disclosure enable effective detection of incorrectlyattached heat sinks before the electronic device 100 reaches damagingtemperatures, thus preventing thermal damage to the electronic device100.

Referring now to FIG. 6 , a graphical representation of thermal responseof an electronic device 100 for varying numbers of tightened anduntightened heat sink components is shown. As illustrated, curve 602represents to a baseline thermal response on electronic device 100having two properly connected and tightened lock mechanisms, such aswedge lock devices, curve 604 represents the thermal response of theelectronic device 100 when both lock mechanisms, such as wedge locks,are completely loosened, and curve 606 represents the thermal responsewhen one of the lock mechanisms, such as wedge locks, is tightenedproperly and the other is loosened.

As discussed in relation to FIG. 3 , a threshold ramp rate can thus bedetermined from curve 604. Additionally, an offset ramp rate can bedetermined from curve 606. In application, the offset ramp rate can beused to indicate to an operator when one of the heat sink components isincorrectly attached while the other is properly connected. Such anindication of partial fault may enable the operator to continueoperation of the electronic device cautiously to complete the intendedtask while monitoring the thermal response. Embodiments of the presentdisclosure can thus enable detection of varying numbers of incorrectlyattached heat sink components. For instance, if it is determined thatthe thermal ramp rate of electronic device 100 exceeds the thermal ramprate corresponding to offset curve 606 but has not reached the thresholdramp rate corresponding to curve 604, a fault signal indicates to anoperator that one but not both of lock mechanisms 104 a, 104 b isincorrectly attached.

Referring now to FIG. 7 , a flowchart of a method 700 for detecting anincorrectly attached heat sink component on an electronic device 100 isillustrated. In particular, method 700 enables individual detection ofat least two separate heat sink components, such as opposing lockmechanisms 104 a, 104 b, such as wedge locks, on a circuit card carrier102, as shown in FIGS. 1A-1B. One skilled in the art should appreciatedthat method 700 can be reduced or expanded to monitor fewer oradditional heat sink components if so desired.

Method 700 begins at 702 with waiting a specified period of time toallow the electronic device to power up before beginning to monitor forincorrectly attached heat sink components. Monitoring of the thermalresponse before the device is powered up could result in premature faultsignals as the thermal ramp rate is generally greater during power up(as shown in FIG. 3 , for example) and could thus exceed thepredetermined thermal ramp rate temporarily.

After the specified period has passed, the method at 704 includes thereceipt of real-time temperature data from first and second sensors(e.g., left and right temperature sensors 214 a, 214 b) associated withfirst and second heat sink components 104 a, 104 b. In other words, thefirst sensor 214 a is placed in relative proximity to the first heatsink component 104 a, and the second sensor 214 b is placed in relativeproximity to the second heat sink component 104 b. The method utilizesthe received real-time temperature data from the first and secondsensors 214 a, 214 b to calculate respective first and second thermalramp rates at 706.

The current ambient or component temperature and power consumption ofthe device are received from sensors 210 associated with the electronicdevice 100 at 708. These two parameters are then used to select apredetermined threshold ramp rate 212 from a chart or database 206 ofthreshold ramp rates 212, the selection based on the current ambient orcomponent temperature and power consumption of the electronic device 100at 710. An example chart of threshold ramp rates 212 corresponding toambient or component temperature and power consumption is provided inFIG. 5 of the present disclosure.

The selected threshold ramp rate 212 is compared to the calculated firstand second thermal ramp rates at 712, and if it is determined thateither the first thermal ramp rate or the second thermal ramp rates doesnot exceed the predetermined ramp rate 212 corresponding to the presentambient or component temperature and power consumption (updated at eachiteration of the method at 710), real-time temperature data is received,at 704, and the thermal ramp rate associated with the first and secondheat sink components 104 a, 104 b is continuously monitored (repeatingthe method from 704 through 712) . During such continuous monitoring,however, if it is determined that the calculated first or second thermalramp exceeds the predetermined ramp rate 212, such as at 712, a faultsignal is transmitted to a user interface 222 to notify the operator ofan incorrectly attached heat sink component 104 a or 104 b, or relatedissue at 714. The fault signal can generally indicate a fault or canspecify which of the heat sink components 104 a or 104 b is incorrectlyattached.

Various fault signals can be transmitted for various scenarios. Forinstance, if it is determined that the first thermal ramp rate exceedsthe second thermal ramp rate by a specified amount, the operator isnotified that the first heat sink component 104 a is incorrectlyattached or otherwise at fault. Stated another way, if the first thermalramp rate is greater than the second thermal ramp rate, the transmittedfault signal identifies that the heat sink component 104 a isincorrectly attached. If instead it is determined that the secondthermal ramp rate exceeds the first thermal ramp rate, the operator isnotified that the second heat sink 104 b is incorrectly attached orotherwise at fault. Stated another way, if the second thermal ramp rateis greater than the first thermal ramp rate, the transmitted faultsignal identifies that the heat sink component 104 b is incorrectlyattached. A general fault signal may also be transmitted to notify theuser if either or both of the first and second thermal ramp rates exceedthe threshold ramp rate 212.

When a fault signal is transmitted, a record of the fault is made at716. The record or log can include the time the fault occurred and anyrelated data that may be useful in subsequent failure analysis. Forexample, a data log is kept to inform the operator of exactly how muchtime passed wherein the electronic device 100 was exceeding thethreshold ramp rate 212. Such a log can be stored, for example in thememory 218 of controller 208 or be written to existing storage ofelectronic device 100 or a separate storage device by I/O 220 ofcontroller 208.

Finally, the method includes, at 718, a decision as to whether tocontinue operation of the electronic device despite an indication of anincorrectly attached heat sink component. For example, if the electronicdevice 100 is critical to the operation of the overall system or vitalto the safety of the operator, the method includes returning to 704 toreceive real-time temperature data from the first and second sensors andthe method continue. By contrast, in order to prevent damage to theelectronic device 100, a non-critical electronic device 100 may beconfigured to automatically reset or shut down when it is determinedthat a heat sink component is incorrectly attached, such as when thedetermination at 718 is in the negative. Such decisions can bepredetermined and implemented automatically via software, firmware, orthe like to stop or continue operation and monitoring of the electronicdevice.

The methods described herein may be implemented under a variety ofcircumstances, such as a laboratory testing of an electronic device,during inspections of a manufactured product prior to release, during anoperation pre-check, during operation, and so forth.

Further, the methods may be practiced by a computer system including oneor more processors and computer-readable media such as computer memory.In particular, the computer memory may store computer-executableinstructions that when executed by one or more processors cause variousfunctions to be performed, such as the acts recited in the embodiments.

Embodiments of the present invention may comprise or utilize a specialpurpose or general-purpose computer including computer hardware, asdiscussed in greater detail below. Embodiments within the scope of thepresent invention also include physical and other computer-readablemedia for carrying or storing computer-executable instructions and/ordata structures. Such computer-readable media can be any available mediathat can be accessed by a general purpose or special purpose computersystem. Computer-readable media that store computer-executableinstructions are physical storage media. Computer-readable media thatcarry computer-executable instructions are transmission media. Thus, byway of example, and not limitation, embodiments of the invention cancomprise at least two distinctly different kinds of computer-readablemedia: physical computer-readable storage media and transmissioncomputer-readable media.

Physical computer-readable storage media includes RAM, ROM, EEPROM,CD-ROM or other optical disk storage (such as CDs, DVDs, etc.), magneticdisk storage or other magnetic storage devices, or any other mediumwhich can be used to store desired program code means in the form ofcomputer-executable instructions or data structures and which can beaccessed by a general purpose or special purpose computer.

A “network” is defined as one or more data links that enable thetransport of electronic data between computer systems and/or modulesand/or other electronic devices. When information is transferred orprovided over a network or another communications connection (eitherhardwired, wireless, or a combination of hardwired or wireless) to acomputer, the computer properly views the connection as a transmissionmedium. Transmission media can include a network and/or data links whichcan be used to carry desired program code means in the form ofcomputer-executable instructions or data structures and which can beaccessed by a general purpose or special purpose computer. Combinationsof the above are also included within the scope of computer-readablemedia.

Further, upon reaching various computer system components, program codemeans in the form of computer-executable instructions or data structurescan be transferred automatically from transmission computer-readablemedia to physical computer-readable storage media (or vice versa). Forexample, computer-executable instructions or data structures receivedover a network or data link can be buffered in RAM within a networkinterface module (e.g., a “NIC”), and then eventually transferred tocomputer system RAM and/or to less volatile computer-readable physicalstorage media at a computer system. Thus, computer-readable physicalstorage media can be included in computer system components that also(or even primarily) utilize transmission media.

Computer-executable instructions comprise, for example, instructions anddata which cause a general-purpose computer, special purpose computer,or special purpose processing device to perform a certain function orgroup of functions. The computer-executable instructions may be, forexample, binaries, intermediate format instructions such as assemblylanguage, or even source code. Although the subject matter has beendescribed in language specific to structural features and/or themethods, it is to be understood that the subject matter defined in theappended claims is not necessarily limited to the described features ormethod described above. Rather, the described features and method aredisclosed as example forms of implementing the claims.

Those skilled in the art will appreciate that the invention may bepracticed in network computing environments with many types of computersystem configurations, including, personal computers, desktop computers,laptop computers, message processors, hand-held devices, multi-processorsystems, microprocessor-based or programmable consumer electronics,network PCs, minicomputers, mainframe computers, mobile telephones,PDAs, pagers, routers, switches, and the like. The invention may also bepracticed in distributed system environments where local and remotecomputer systems, which are linked (either by hardwired data links,wireless data links, or by a combination of hardwired and wireless datalinks) through a network, both perform tasks. In a distributed systemenvironment, program modules may be located in both local and remotememory storage devices.

Alternatively, or in addition, the functionality described herein can beperformed, at least in part, by one or more hardware logic components.For example, and without limitation, illustrative types of hardwarelogic components that can be used include Field-programmable Gate Arrays(FPGAs), Application-specific Integrated Circuits (ASICs),Application-specific Standard Products (ASSPs), System-on-a-chip systems(SOCs), Complex Programmable Logic Devices (CPLDs), etc.

The present invention may be embodied in other specific forms withoutdeparting from its spirit or characteristics. The described embodimentsare to be considered in all respects only as illustrative and notrestrictive. The scope of the invention is, therefore, indicated by theappended claims rather than by the foregoing description. All changeswhich come within the meaning and range of equivalency of the claims areto be embraced within their scope.

What is claimed is:
 1. A system for detecting an incorrectly attachedheat sink component on an electronic device, the system comprising: oneor more temperature sensors secured to the electronic device; and acontroller unit comprising one or more processors and one or morecomputer-readable media, the one or more computer-readable media of thecontroller unit having stored thereon instructions that are executableby the one or more processors to perform at least the following: receivetemperature data from the one or more temperature sensors; calculate athermal ramp rate of the electronic device; determine that thecalculated thermal ramp rate exceeds a predetermined threshold ramprate; and transmit a fault signal to a user interface component when thecalculated thermal ramp exceeds the predetermined threshold ramp rate.2. The system of claim 1, wherein the executable instructions areexecutable by the one or more processors of the controller unit to:receive ambient or component temperature data and power output data fromthe electronic device; and select the predetermined threshold ramp ratefrom a database containing a plurality of threshold ramp rates, eachthreshold ramp rate corresponding to a particular ambient or componenttemperature and power output of the electronic device.
 3. The system ofclaim 2, further comprising a programmable memory unit having storedthereon the database containing the plurality of threshold ramp rates.4. The system of claim 3, further comprising a serial communication busconfigured to transfer data between the electronic device, the one ormore temperature sensors, the programmable memory unit, and thecontroller unit.
 5. The system of claim 4, wherein one or morecomponents of the hardware system are directly integrated with anexisting circuit card assembly of the electronic device.
 6. The systemof claim 1, wherein each of the one or more temperature sensors isconfigured to measure a temperature of the electronic device at alocation proximate a heat sink component associated therewith.
 7. Thesystem of claim 6, wherein the one or more temperature sensors comprisefirst and second temperature sensors, and wherein the executableinstructions are executable by the one or more processors of thecontroller unit to: calculate first and second thermal ramp ratescorresponding to the first and second temperature sensors respectively;determine that the first thermal ramp rate is greater than the secondthermal ramp rate; and transmit a fault signal to a user interfacecomponent when the first thermal ramp rate is greater than the secondthermal ramp rate, such that the user interface component indicates thatthe heat sink component associated with the first temperature sensor isincorrectly attached.
 8. The system of claim 6, wherein the executableinstructions are executable by the one or more processors of thecontroller unit to: calculate first and second thermal ramp ratescorresponding to the first and second temperature sensors respectively,and determine that one of the first thermal ramp rate and the secondthermal ramp rate is greater than the predetermined threshold ramp rateusing ambient or component temperature and power output values; andtransmit a fault signal to a user interface component when the firstthermal ramp rate or the second thermal ramp rate is greater than thepredetermined threshold ramp rate, such that the user interfacecomponent indicates that the heat sink component associated with thefirst temperature sensor is incorrectly attached.
 9. The system of claim1, wherein the executable instructions are executable by the one or moreprocessors of the controller unit to transmit a reset command to theelectronic device when the calculated thermal ramp rate exceeds thepredetermined threshold ramp rate.
 10. The system of claim 1, whereinthe electronic device comprises at least one circuit card assemblyenclosed within a ruggedized carrier by one or more lock mechanisms,each lock mechanism providing a thermal cooling path between the atleast one circuit card assembly and the ruggedized carrier when the lockmechanism is properly secured.
 11. A method of detecting an incorrectlyattached heat sink component on an electronic device, the methodcomprising: identifying a thermal ramp rate of the electronic devicewhile the electronic device is in operation; determining that theidentified thermal ramp rate exceeds a predetermined threshold ramprate; and transmitting a fault signal to a user interface when theidentified ramp rate exceeds the predetermined threshold ramp rate. 12.The method of claim 11, further comprising waiting a predeterminedperiod of time to allow the electronic device to power up beforeidentifying the thermal ramp rate of the electronic device.
 13. Themethod of claim 11, further comprising: identifying an ambient orcomponent temperature and a power consumption of the electronic device;and selecting the predetermined threshold ramp rate from a plurality ofthreshold ramp rates, each of the plurality of threshold ramp ratescorresponding to a particular ambient or component temperature and powerconsumption of the electronic device.
 14. The method of claim 11,further comprising transmitting a reset command to the electronic devicewhen the identified thermal ramp rate exceeds the predeterminedthreshold ramp rate.
 15. The method of claim 14, wherein transmission ofthe reset command is based upon an operational status of the electronicdevice.
 16. The method of claim 11, further comprising determining thata specific quantity of heat sink components are incorrectly attached bydetermining that the identified thermal ramp rate exceeds a baselineramp rate by a predetermined offset value.
 17. The method of claim 11,further comprising recording a data log for analysis of the electronicdevice, the data log comprising a record of operational use of theelectronic device whilst a heat sink component was incorrectly attached.18. A computer-readable media comprising one or more physicalcomputer-readable storage media having stored thereoncomputer-executable instructions that, when executed at a processor,cause a computer system to perform a method for detecting an incorrectlyattached heat sink component on an electronic device, the methodcomprising: receiving data related to a status of the electronic devicewhile in operation, the received data comprising a temperature of theelectronic device; identifying a thermal ramp rate of the electronicdevice using the received data; determining that the identified thermalramp rate exceeds a predetermined threshold ramp rate; and transmittinga fault signal to a user interface when the identified thermal ramp rateexceeds the predetermined threshold ramp rate.
 19. The computer-readablemedia of claim 18, wherein the received data further comprises anambient or component temperature and a power consumption of theelectronic device.
 20. The computer-readable media of claim 19, whereinthe method further comprises selecting the predetermined threshold ramprate from a plurality of threshold ramp rates, each of the plurality ofthreshold ramp rates corresponding to a particular ambient or componenttemperature and power consumption of the electronic device.